| October 21 No.3 Meeting Room, First Floor |
|
Time Slot
|
Topic
|
Company / Speaker
|
|
10:30 - 12:00
|
Modular Workflow for Designing Finite Antenna Array with Layout-Based Feed Network
|
ANSYS
Cong Li
Senior Application Engineer
|
|
An Instruction to Solvers in ANSYS HFSS
|
Hao Li, Ph.D
Senior Application Engineer
|
|
EMI aware SI and PI
|
ANSYS
Minggang Hou
Regional Technical Manager
|
|
13:20 - 13:50
|
Emerging RF Technologies Through Multiphysics Simulation
|
COMSOL
|
|
13:55 – 14:25
|
Test result of key PCB fabrication factors impact on PIM performance
|
Rogers
Sharon Young
Asia Market Develop Manager of ACS
|
|
14:30 – 15:00
|
Disruptive Thin-Film Microwave technology for 5G telecom application and Defense application
|
Knowles Capacitors
Simon Mao
Asia Marketing Manager
|
| October 21 No.6 Meeting Room, Second Floor |
|
Time Slot
|
Topic
|
Company / Speaker
|
|
10:30 – 11:00
|
Interconnect Solutions for High Frequency RF & Microwave applications Cinch Connectivity Solutions
|
Robert Shen
Senior Product engineer
|
|
13:20 – 13:50
|
SiGe BiCMOS Technologies and RF Technology Modules offered via MPW and Foundry Service
|
IHP GmbH
Dr. Rene Scholz
MPW Project Leader
|
