5G技术的发展，对无论是6GHz以下的低频频段，或者是28GHz/39GHz毫米波频段的电路设计都提出了高集成度的要求，设计工程师将更多的采用多层板电路结构。PCB电路中的射频信号过孔在多层板的结构中是几乎不可避免的。过孔参数的变化使在高频微波频段下产生的寄生电容和寄生电感对电路阻抗匹配及性能产生影响。

本演讲将首先介绍多层板电路中过孔的基本结构，讨论过孔参数变化产生的性能影响，以及如何进行过孔的优化设计获得更优的电路性能，最后就工程师普遍关注的过孔孔壁粗糙度是否会对微波电路性能产生影响进行重点讨论。

With the development of 5G technology, higher integration is required. Design engineers have to adopt multi-layer board circuit structure in the design at sub-6GHz low frequency band and 28GHz/39GHz millimeter wave band. It is inevitable that PTH vias will be used for RF signal transition in the structure of multi-layer board. However, PTH via’s variations have an effect on the impedance matching and performance of the circuit due to the parasitic capacitance and inductance in the high frequency microwave band.

This presentation will first introduce the PTH via structure in multilayer board circuit, and then discuss the performance influence caused by via variations, and how to optimize the design to obtain best performance. At the end, the influence of the roughness of PTH via wall on the performance of microwave circuits will be discussed.